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First topical meeting of the RPI Broadband
Center for Data Communications
|
10:00-10:30
|
Introductions and Research Overview
– Marc Taubenblatt (IBM)
|
| 10:30-10:45 |
Welcome – T.C. Chen, VP Science
and Technology (IBM) |
| 10:45-11:05 |
John Magerlein (IBM – MEMS
of Resonators and Switches Compatible with Bi-CMOS Processing |
| 11:05-11:25 |
Prof. Ronald Guttman (RPI)
– A 3D IC Technology Platform: Current Status and Future
Directions |
| 11:25-11:45 |
Paul Andry (IBM) – Silicon-Based
System on Package Concepts |
| 11:45-12:05 |
Prof. Kevin Kornegay (Cornell)
– An Overview of Packaging and Device Processing Research
at Cornell |
| 12:05 -12:30 |
Lunch |
| 12:30-12:50 |
Prof. Eric Eisenbaum/Prof.
Bai Xu (U. Albany) – Multi-Dimensional Integration: Cross-Disciplinary
Challenges |
| 12:50-1:10 |
Prof. Peter Persans (RPI) –
Low Temperature Processing for Optical Interconnect Waveguide
Components |
| 1:10-1:30 |
Steve Buchwalter (IBM) – Understanding
Reliability of Microelectronic Packaging |
| 1:30-1:45 |
Ron Nunes (IBM) – Overview
of Electro-Optic Packaging Line |
| 1:45-2:45 |
Tour of Electro-Optic Packaging
Line (University visitors only) |
| 2:45-3:00 |
Post Tour Discussion/Questions
|
| 3:00-4:00 |
Discussion/Potential interactions,
proposals (ALL) |
| 4:00-4:15 |
Wrap up |
