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IEEE LESTER EASTMAN CONFERENCE ON HIGH PERFORMANCE DEVICES |
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BEST PAPER AWARD (BAE) BEST STUDENT PAPER
AWARD (U |
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IEEE
Lester Eastman Conference on High Performance Devices (previously Biennial IEEE/Cornell University Conference on High Performance Devices) August 4-6
(Wednesday-Friday), 2004 Sponsored by: the electron device SOCIETY (EDS) of ieee DARPA RPI |
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Papers are solicited covering
the physics and performance of devices and circuits for high speed/frequency, high
or low power, and optoelectronics. Technical thrust areas will include: wide
bandgap materials and devices; narrow bandgap, low power materials and devices;
and heterogeneous integration of dissimilar materials and devices. Papers that
emphasize innovative device concepts and physical phenomena leading to new
devices are particularly encouraged. There will be invited papers in key areas.
The proceedings of the conference will be published in International Journal of
High Speed Electronics and Systems. The instructions for the authors and other
information can be found at http://nina.ecse.rpi.edu/shur/cameraready.html
The following
three topical areas comprise the scope of the Conference:
·
Microwave and millimeter wave devices and
circuits
·
Optoelectronic devices and circuits
·
Innovative materials, devices, and
circuits concepts
Topics of
interest within these areas include, but are not restricted to:
·
Novel materials technologies and devices
·
Wide bandgap materials and devices
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High speed and microwave optoelectronics
·
Light sources and detectors
·
Si-based heterostructures
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Terahertz sources and detectors
·
High speed measurement techniques
·
Sb-based devices and circuits
·
High power and high speed packaging
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Innovative concepts
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Heterogeneous integration for increased
functionality
·
Microwave and millimeter wave integrated
circuits
·
Nanometer fabrication and self-assembly
techniques
·
Molecular Electronics
·
Nanotechnology
·
RF MEMS technology for >1GHz
HOTEL INFORMATION – BOOK
BEFORE July 3, 2004 – THE CONFERENCE IS DURING
Lester Eastman Best Student Presentation
Award and Lester Eastman Best Paper Award will be given at the Conference
The Lester Eastman Conference will be held on the Rensselaer Polytechnic
Institute campus in Troy, New York, which is conveniently located 5 miles from Albany
International Airport, 2.25 hours train ride from New York Penn station, a 2.5
hour drive from New York, 2.5 hours drive from Boston, MA and 4 hours drive
from Montreal, Canada (see http://www.rpi.edu/rpinfo/). Both individual and family accommodations
will be available in area hotels and motels.
Dress
code – casual!!!
In order to
encourage student participation, limited financial assistance for travel is
available to first-named student authors who are presenting papers. This
assistance should be requested when the abstract is submitted. Prospective
authors are invited to submit a 300-word abstract and one page of accompanying
figures (pdf file,
electronic submission only) by June 1st, 2004 to: (DEADLINE EXTENDED TO JUNE 1-ST)
Professor James Kolodzey <kolodzey@ee.udel.edu>
2004
Lester Eastman Conference/Program Chair
Department
of Electrical and Computer Engineering
140
Evans Hall,
Voice:
302 831 1164 FAX: 302 831 4316
Details for
abstract submission and on-line registration are available at the conference
web site at Conference Website: http://nina.ecse.rpi.edu/shur/EastmanConference/
Please note
that all necessary company and/or government approvals must be obtained before
abstract submission.
Conference
agenda (TBA)
Session
Organizers and Chairs (TBA)
This page is maintained by Michael
Shur
Updated on 12/12/03