Additional Possible Topics for Final Projects.

Scaling of Si MOSFETs for Digital Applications.

Discuss scaling rules and size limitations. List all possible non-ideal effects and how you expect them to vary with scaling.

Propose solutions where you think they possible. Based on this discussion and literature search choose

AIM-Spice parameters for 1 µm, 0.5 µm, and 0.1 µm technology and design, simulate, and compare ring

oscillators based on these devices.

Si MOSFETs for High Temperature Applications.

Analyze factors limiting high temperature performance. Estimate the highest operating temperature.

Compare with silicon. Analyze effects of temperature on ohmic and Schottky contacts. Compare with data in literature.

Develop reasonable MOSFET Spice model for the military range of temperature and simulate inverter

characteristics representative for this temperature range of operation.

Si MOSFETs Operating at Cryogenic Temperatures.

Analyze factors limiting cryogenic performance. How does it compare with other semiconductor materials?

Compare with data in literature. Develop reasonable MOSFET Spice model for 77 K

and simulate inverter characteristics representative for this temperature range of operation.

High Power Diodes.

Discuss factors limiting maximum power in diode switches. Analyze self-heating effects. Consider contacts and packaging.

Suggest system applications for different power levels.

SiC FETs.

Give a brief review of technical literature on this topic. Discuss basic limitations of SiC which may limit SiC FET performance.

Estimate acceptable contact resistances. Propose FET design and simulate the device characteristics using either

ATLAS-II or AIM-Spice.

Critical look at BSIM-3 MOSFET model in SPICE.

Design of a-Si and poly-silicon TFTs

Critical Comparison of Bipolar and MOSFET technologies. Is Bipolar technology a niche?

High-temperature FETs. Si, GaAs, GaN

Silicon-on-insulator Technology

GaN Devices for High Temperature Applications

Organic Thin Film transistors

MOSFET Modeling

InN Field Effect Transistors

InGaN JFET

InGaN MISFET

InGaN HEMT

Wide band gap power switches

Thermal dissipation in deep submicron MOSFETs

Polysilicon CMOS scaling

Role of interconnects in active matrix technology